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Tianjin MIcro Electronic Material Technology co,.ltd

Products >> BGA/CSP Soldering Ball

BGA/CSP Soldering Ball

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Description
Product Name: BGA/CSP Soldering Ball
Supply Ability: 4000 bottle
Related proudcts
Specifications Sn-pb Pb-ree
Price Term: cif
Port of loading:
Minimum Order 1 bottle
Unit Price:

BGA/CSP Soldering Ball

Contact Us
Company: Tianjin MIcro Electronic Material Technology co,.ltd
Contact: Mr. shean huang
Address: No. 74 4th ave. teda tianjin china
Postcode: 300457
Tel: 86 22 66200227
Fax: 86 22 66201227
E-mail:          


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Tel : 86 22 66200227 Fax : 86 22 66201227
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